Course Title:
Heat Transfer Processes in Microelectronic Devices
Course Description:
Focuses on discussion and development of state-of-the-art methods used to predict the heat transfer rates from microelectronic devices and packages and to simulate transport phenomena in manufacturing processes associated with microelectronic devices. Topics may include use of latent heat reservoirs, boiling jet impingement cooling, control volume approaches to extended surfaces, calculation of thermal contact conductances, and natural convection in enclosures.
Fall Offering:
Lab/Coreq 1:
Spring Offering:
Lab/Coreq 2:
Summer Offering:
Lab/Coreq Remarks:
Summer 1 Offering:
Prerequisite 1:
MTM G200
Summer 2 Offering:
Prerequisite 2:
Cross-Listed Course 1:
Prerequisite 3:
Cross-Listed Course 2:
Prerequisite 4:
Cross-Listed Course 3:
Prerequisite 5:
Cross-Listed Course 4:
Prerequisite Remarks:
Cross-Listed Course 5:
Repeatable:
N
